Institution Name: Manav Rachna International Institute of Research and Studies
Event Type: International Conference
Conference Name: 2026 1st International Electronics & Packaging Technology Conference
Conference Start Date: 02-03-2026
Conference End Date: 03-03-2026
About the Conference:
IEEE EPT Conference 206 is an international conference organized by the IEEE EPS Delhi Chapter and co-sponsored by the IEEE Electronics Packaging Society (EPS) along with Manav Rachna International Institute of Research & Studies on March 2nd – 3rd 2026.
Set in the backdrop of a verdant, green campus in the Aravalli hills, the event is hosted at Manav Rachana International Institute of Research & Studies, Faridabad, Delhi-NCR. It will feature keynotes, tutorials, technical sessions, invited talks, panels, workshops, exhibitions, and networking activities.
Topics include modules, components, materials, equipment technology, assembly, reliability, interconnect design, device and systems packaging, heterogeneous integration, wafer-level packaging, flexible electronics, LED, IoT, 5G, emerging technologies, 2.5D/3D integration technology, smart manufacturing, automation, and AI. Planned in tandem with the Gujarat Semiconnect, the event is expected to pull in ~250 academia/industry participants.
Conference Tracks:
Advanced Packaging Technologies
- Â Heterogeneous Integration and SiP
- Fan-Out Wafer-Level Packaging
- 3D IC and Through-Silicon Vias
- Advanced Substrates and Interposers
Materials and Processes
- Advanced High-Performance Materials
- Thermal Interface Materials
- Soldering & Encapsulation Materials
- Additive Manufacturing & 3D Printing
Reliability and Testing
- Failure Analysis & Reliability Testing
- Mechanical & Thermal Stress Testing
- Advanced Metrology for Packaging
- AI-Driven Reliability Models
Power and RF Packaging
- Power Electronics & Thermal Management
- High-Frequency & RF Applications
- Wide Bandgap Semiconductors (SiC, GaN)
- EMI Shielding Solutions
Emerging Applications
- IoT and Wearable Devices
- Quantum Computing Packaging
- Automotive & Aerospace Packaging
- Biocompatible & Medical Devices
Sustainable & Green Packaging
- Eco-Friendly Materials & Processes
- Recyclability & Circular Economy
- Low-Carbon Manufacturing
- Lifecycle Assessment Solutions
Advanced Interconnects
- High-Density Interconnects
- Flexible & Stretchable Electronics
- Optical & Photonic Integration
- Wireless Interconnects & Antennas
Thermal & Mechanical
- Heat Dissipation in High-Density Packaging
- Modeling & Simulation of Stress
- Thermal Interface Materials
- High-Performance Cooling Solutions
AI, ML & Digital Twin
- AI-Driven Design & Optimization
- Machine Learning for Predictive Analysis
- Digital Twins for Design & Testing
- Automation & Robotics in Packaging
Industry Trends & Standards
- Standardization in Packaging Processes
- Academia-Industry Collaboration
- Future Trends in Semiconductor Packaging
- Industry Innovation Case Studies
Who can participate? Industry/ Students/Academicians
Registration Fee:
| Category | Author Category | IEEE Members/ MRIIRS |
Non-IEEE Members |
|---|---|---|---|
|
Industry
|
Indian Authors (INR) | ₹10,000 | ₹11,000 |
| Foreign Authors (USD) | $350 | $400 | |
|
Academician
|
Indian Authors (INR) | ₹8,500 | ₹9,500 |
| Foreign Authors (USD) | $300 | $350 | |
|
Students
|
Indian Authors (INR) | ₹6,000 | ₹7,000 |
| Foreign Authors (USD) | $200 | $250 | |
|
Attendee Only
|
Indian Attendees (INR) | ₹2,000 | ₹3,000 |
| Foreign Attendees (USD) | $50 | $100 |
Bank Details
- Name of Account: Manav Rachna Innovation and Incubation Foundation
- Account Number: 661301701761
- IFSC Code: ICIC0006613
- Bank Name: ICICI Bank
- Branch: Faridabad Nh Western Extn Branch
Submit Your Paper: Click here
Important Dates:
- Call for Papers Launched:July 15, 2025
- Submission Deadline:December 1, 2025
- Notification of Acceptance:December 19, 2025
- Camera Ready Deadline:January 23, 2026
- Conference Dates:March 2-3, 2026
Contact:
Email: umeshdutta.set@mriu.edu.in
Venue:
